2024 SEMICON Taiwan

Breaking Limits：Powering the AI Era

Location

TaiNEX 1&2, Taipei

Date

2024 / 9/4~ 9/6

2024 Recap — The Premier Microelectronics Event

The SEMICON Taiwan 2024 International Semiconductor Exhibition grandly opened on September 4 at the Taipei Nangang Exhibition Center, with the participation of Executive Yuan Premier Su Tseng-chang, SEMI Global President and CEO Ajit Manocha, TSIA Executive Director and UMC Chairman and CEO Lu Chao-chun, along with several government and industry representatives. This year’s exhibition attracted over 85,000 industry experts from 56 countries worldwide, showcasing more than 1,100 leading companies and 3,700 booths. During the event, more than 20 international forums were held, inviting around 200 prominent experts to share insights and trends in the industry.

The global semiconductor industry is experiencing significant growth, with SEMI forecasting that the market will reach $1 trillion by the end of 2030. This growth is particularly driven by the semiconductor sector’s impact on artificial intelligence (AI). This year’s SEMICON Taiwan 2024 exhibition also responds to the AI trend, with the theme “Breaking Limits: Powering the AI Era.” The opening countdown is underway, and the event will officially kick off on September 4. This year, the exhibition has expanded in scale, featuring a dual-venue format for the first time, along with the introduction of the “AI Semiconductor Technology Concept Zone,” “AI Interactive Experience Zone,” and multiple international forums showcasing the latest AI technologies.

As the applications of the semiconductor industry continue to expand, high-tech applications such as semiconductors have experienced robust development. This year’s SEMICON Taiwan exhibition, the most influential semiconductor event in the world, will be held in a dual-venue format for the first time. In addition to maintaining a focus on popular semiconductor topics, including advanced processes, equipment materials, heterogeneous integration, compound semiconductors, smart manufacturing, green manufacturing, cybersecurity, and talent, leading companies will showcase their latest research and development achievements and technological applications on-site. New additions this year, such as the forum featured the “AI Chip Fireside Chat,” moderated by Dr. Tien Wu, CEO of ASE Group. Dr. Y.J. Mii, Executive Vice President and Co-Chief Operating Officer of TSMC, Dr. Jung-Bae Lee, Corporate Head of Memory Business at Samsung Electronics, and Hamidou Dia, Vice President of Applied AI Engineering at Google, gathered to explore various issues in the AI era, ranging from technological integration, social impact, and the construction of industrial chains to changes in geopolitical dynamics, and how AI technology will shape the future of the world.

Ajit Manocha, the global president and CEO of SEMI, highlighted that Taiwan boasts a complete and robust semiconductor supply chain, spanning front-end manufacturing, packaging/testing, and design/R&D. He noted Taiwan’s significant role in the AI industry and its contributions to global economic growth. Manocha predicts that over the next seven years, more than 50% of industry growth will stem from AI applications, with market size expected to grow from $600 billion to $1 trillion, potentially exceeding $4 to $5 trillion by 2040-2050 with the rise of quantum technology. Currently, the semiconductor sector faces challenges such as talent shortages, supply chain disruptions, and sustainability. Global cooperation is essential to tackle these issues, and Taiwan will play a crucial role in overcoming them.

Additionally, government officials, including Minister of Economic Affairs Wang Mei-hua and Minister of Digital Development Audrey Tang, attended the event, underscoring the government’s strong commitment to the semiconductor industry, which is vital for Taiwan’s economic growth and future technological innovation.

Visit official website: https://www.semicontaiwan.org/zh

Expo Review

Global Semiconductor Giants Gather To Witness Industry Prosperity！

The CEO Summit kicked off on the exhibition’s opening day, featuring key players from the global semiconductor supply chain, including TSMC, Applied Materials, Google, imec, Marvell, Microsoft, Samsung Electronics, and SK hynix. They explored industry dynamics, market trends, and advanced technologies across manufacturing, packaging, memory, and chip design. This year introduced the “AI Chip Fireside Chat,” moderated by Dr. Tien Wu, CEO of ASE Group. Participants included Dr. Y.J. Mii from TSMC, Dr. Jung-Bae Lee from Samsung Electronics, and Hamidou Dia from Google, discussing technological integration, social impacts, industrial chains, and geopolitical shifts in the AI era.

With the rise of the HPC/AI era, the SEMICON Taiwan Heterogeneous Integration Global Summit 2024 features diverse discussions on technologies like HBM, silicon photonics, CPO, hybrid bonding, and liquid cooling. The summit aims to foster cross-sector collaboration and unveil new applications. This year marks the debut of the 3D IC/CoWoS for AI Summit and the FOPLP Innovation Forum, led by TSMC and ASE, focusing on the latest developments in packaging technologies. These events are expected to attract over 2,500 industry professionals and highlight advancements in next-generation FOPLP technology, enhancing semiconductor manufacturing capabilities.

This year’s exhibition attracted over 85,000 industry experts from 56 countries worldwide, showcasing more than 1,100 leading companies and 3,700 booths.

In addition to maintaining a focus on popular semiconductor topics, including advanced processes, equipment materials, heterogeneous integration, compound semiconductors,

New additions this year, such as the forum featured the “AI Chip Fireside Chat,” moderated by Dr. Tien Wu, CEO of ASE Group. Dr. Y.J. Mii, Executive Vice President and

NETIOTEK x MACNICA

Jointly showcasing ADI's latest technology: 10Base-T1L networking technology.

Highlights of the Analog Devices (ADI) Event:

◎ Smart Industrial Innovation: Experience how ADI accelerates industrial automation and enhances production efficiency.

◎ Smart Sensor Applications: Explore how ADI sensors empower devices for precise monitoring.

◎Autonomous Driving Technology Insights: Learn how ADI provides reliable and efficient semiconductor solutions for autonomous driving.

Netiotek teamed up with Macnica to showcase at Analog Devices (ADI) booth in Semicon Taiwan 2024. We co-exhibited the latest network technology- 10base T1L and how it can solve the pain points for automation, smart building, and smart factory. T1L announced by IEEE, also know as IEEE 802.3 cg. Data transportation can be at a speed of 10 million bits per second. It can transit both signal and power through just a single pair twisted cable.

To deploy T1L can solve issues when it comes to long distance data connectivity. It provides robust connection and to be more cost effective in wiring. We demonstrated this new and reliable technology by showing you how it can stably read remote legacy devices data and make it digitize easily.

Media Report

Netiotek Featured in EETimes!

We extend our gratitude to EETimes for the interview. As highlighted, Netiotek has been a leader in industrial computing for over 20 years, focusing on developing tailored solutions for various application scenarios. Recently, we introduced an industrial IoT gateway designed for edge computing, staying at the forefront of industry trends. At the automation exhibition, we showcased a vision recognition system operating at a distance of 300 meters, capable of digitizing and transmitting machine data. With T1 communication technology, users can view real-time data on screens connected to the IoT gateway. When monitoring remote equipment, users can avoid concerns about potential interference from wireless communication.

Netiotek will continue to advance in industrial computing technology, delivering exceptional service to end users!